Hotline: 678-408-1354

Die/Wire Bond Operator 2nd shift

Die/Wire Bond Operator 2nd shift 108 views

Job Overview

Job Responsibilities:
This position will run Besi Datacon 2200, Micron and Palomar Die Attach machines, Topaz Chip Shooter, EKRA and DEK printers, K&S ICONN Wire bonders, Midas HGRS-V Hot Gas Die rework machine and K&S Manual Wire Bonder

  • Uses assembly drawings and related paperwork (Router, Pick List, bill of material) to accompany parts through production flow
  • Uses written instructions to assemble, modify, rework or reassemble units
  • Performs basic and routine electronic assembly operations on components or subassemblies
  • Technical Knowledge of Die attach, Wire bond, Epoxy Dispense, Flipchip, Wafer Die Eject, Die Attach Films, Material Handling Loaders and Unloaders, Conveyors, Screen and Stencil Printing, Chip Shooter/Passive Component Attach
  • Maintains daily records and periodically summarizes activities
  • May be required to work overtime
  • Interface with Engineers and Technicians
  • Ability to operate and multi-task between 2 to 3 machines
  • Knowledge of scope equipment inherent in this position
  • Process transactions on Oracle (ERP) system

Minimum/Basic Job Qualifications:

  • Preferred minimum of Five-year’s experience in Die and Wire Bond assembly
  • Ability to multi-task is a must
  • Ability to use optical microscope (up to 10 — 100x) 50% of your time
  • Must have good computer skills in Microsoft Office to include Outlook and Excel
  • Must have good eye/hand coordination and a steady hand
  • Good written and verbal communication skills
  • Good interpersonal skills and ability to work effectively in a team environment

Equal Opportunity Employer Minorities/Women/Protected Veterans/Disabled

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Eltas EnterPrises Inc.
3978 Windgrove Crossing
Suite 200A
Suwanee, Georgia
30024, USA
contact@eltasjobs.com

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