Hotline: 678-408-1354

Signal Integrity Intern

Req. ID: 116381

The Signal Integrity Research and Development (SI R&D) team supports all of Micron’s current and future product development. Major product technologies include DRAM, Low-Power DRAM, Reduced Latency DRAM, NAND, NOR, and Solid State Drives within the consumer, server, wireless, and embedded product groups. A major focus for the SI R&D team is integrated circuit package modeling and analysis. The team owns all steps of the signal and power integrity support process including die and package model generation, product electrical signaling performance analysis, system-level SI evaluation, measurement, correlation, and customer support. The team also supports future specification development within several industry standards groups including JEDEC, ONFI, and IBIS. The group’s working environment is diverse, challenging, and team oriented.

As a Signal Integrity engineer intern you will be exposed to different product modeling and analysis methods, primarily responsible for learning how to create integrated circuit package models using 3D EM simulation tools for system simulations and analysis. You may also work with various time and frequency domain simulators. You will support and learn from lead and principle Signal Integrity engineers while interacting with package design, silicon design, product engineering, and marketing departments.


Qualifications

Successful candidates for this position will have:

  • Two semesters or less to complete a BSEE or MSEE (or equivalent degrees) with an avg. GPA 3.2/4.0 or higher
  • Required, coursework covering electromagnetics, transmission lines and RF theory
  • Very desirable to have experience with I/O design, signal integrity principles, and printed circuit board (PCB) layout techniques
  • Desirable to have exposure to simulation, modeling, and analysis tools

    • HSPICE, ADS, HFSS, ANSOFT, Matlab, and others.
  • Desirable to have an understanding of and experience with measurement equipment

    • Oscilloscopes, TDR, Vector Network Analyzer (VNA), etc.
  • Candidate should be self-motivated and enjoy taking ownership of assigned projects, exhibit good written and verbal communication skills, and have the ability to work well independently and in a diverse team environment.

We recruit, hire, train, promote, discipline and provide other conditions of employment without regard to a person’s race, color, religion, sex, age, national origin, disability, sexual orientation, gender identity and expression, pregnancy, veteran’s status, or other classifications protected under law. This includes providing reasonable accommodation for team members’ disabilities or religious beliefs and practices.

Each manager, supervisor and team member is responsible for carrying out this policy. The EEO Administrator in Human Resources is responsible for administration of this policy. The administrator will monitor compliance and is available to answer any questions on EEO matters.

To request assistance with the application process, please contact Micron’s Human Resources Department at 1-800-336-8918 (or 208-368-4748).

Keywords: Boise || Idaho (US-ID) || United States (US) || DEG (DRAM Engineering Group) || Entry || Internship || Engineering || Not Applicable ||

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